We offer full fabrication services for Silicon and GaAs micromachined components on wafers up to 4 inches in diameter and of thicknesses starting at 100 mm. EMAG has immediate access to local microfabrication facilities with a variety of equipment including:

• Furnaces: Oxidation, Diffusion/Doping, LPCVD
• Lithography: Mask maker, ACS-200 Cluster Tool, AS200 Autostep, E-Beam, Spinners, Front and Backside Alignment (MA/BA-6, EVG 620, MJB-3), Hotplates/Ovens
• Plasma Tools: PECVD, RIE, STS DRIE, nP12 Plasma Activation Tool
• Metal Deposition: Enerjet Evaporator, Enerjet Sputter Coater, Gold Platting Station
• Wafer Bonding: SB6e, EVG501, CL200, Wire Bonder, Dicing Saw
• Metrology: Microscopes, Dektak, Ellipsometer, Nano-spec Thin Film Thickness Measuring System, Scanning Electron Micrograph Philips XL30 FEG, Zygo, Keithley 4200
• Wet Processing: Chemical Benches, Wet Anisotropic Etching, CPD

We also feature in-house printed circuit board (PCB) milling, chemical etching, through-hole plating, and surface mount and conductive epoxy component assembly. RoHS compliance is available.