EMAG's facilities in Ann Arbor, MI, provide a wide range of design, fabrication, embedded programming, integration, prototyping, test & measurement and light manufacturing capabilities for RF,
microwave and millimeter wave system applications.
Our engineers utilize a wide array of industry grade simulation, layout and verification tools during design process. Custom CAD software tools are developed in-house at our EMAGWARE division.
Broad expertise and proven experience in computer aided design and modeling of RF systems are key to quick turnaround delivery of high quality systems and products on time and on budget.
Our integrated RF systems incorporate a combination of Printed Circuit Board (PCB), Silicon and Gallium Arsenide (GaAs) technologies. Besides in-house PCB milling, chemical etching, wire bonding, surface mounting
and conductive epoxy component assembly, we can fabricate Silicon and GaAs micromachined components on wafers up to 4 inches in diameter. Through business arrangement with the University of Michigan's Nanofabrication Center,
our engineers have immediate access to advanced equipment such as plasma tools (PECVD, RIE, STS DRIE), metal deposition tools, oxidation, diffusion/doping and LPCVD furnaces, etc.
EMAG's laboratories are equipped with state-of-the-art high frequency circuit and antenna characterization and measurement systems including:
PNA series vector network analyzers & spectrum analyzers up to 67 GHz
Cascade probe station with on-wafer measurement capability up to 67 GHz
High speed, high frequency digital oscilloscopes & logic analyzers
Computer-controlled anechoic chamber
Screened chamber (Faraday cage) for EMC/EMI testing
Temperature-controlled chamber for thermal cycling
Electric & magnetic field probing & scanning systems
